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United Kingdom
6804210050
Wheels suitable for grinding, rounding, polishing, aligning or cutting: -composed of metal base and agglomerated synthetic or natural diamonds, -whether or not containing a hole in the centre, -with an external diameter not more than 870 mm, for machines for the manufacture of semiconductor wafers
Details
- Parent HS6
- 680421 Millstones, grindstones, grinding wheels and the like; of agglomerated synthetic or natural diamond
Related United Kingdom Codes
6804210020
Discs<br> <br><br><br>- of synthetic diamonds which are agglomerated with a metal alloy, ceramic alloy or plastic alloy,<br> <br><br><br>- having a self-sharpening effect by constant release of the diamonds,<br> <br><br><br>- suitable for abrasive cutting of wafers,<br> <br><br><br>- whether or not containing a hole in the centre,<br> <br><br><br>- whether or not on a support<br> <br><br><br>- with a weight of not more than 377 g per piece and<br> <br><br><br>- with an external diameter of not more than 206 mm<br>
6804210040
Steel wire used for cropping and squaring semiconductors:
-coated with diamond grains of 5µm or more, but not more than 55µm
-wire diameter 23 µm or more but not more than 350 µm,
-having a breaking strength of 11 N or more, but not more than 170 N
6804210050
Wheels suitable for grinding, rounding, polishing, aligning or cutting:
-composed of metal base and agglomerated synthetic or natural diamonds,
-whether or not containing a hole in the centre,
-with an external diameter not more than 870 mm, for machines for the manufacture of semiconductor wafers
6804210090
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